Electronics & Embedded Systems for Vehicle Platforms
Circuits, digital electronics, microcontrollers, sensors and actuators, and in-vehicle networks — the electronics literacy structural and materials engineers now need.
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Faculty
Faculty details for this seminar will be announced with the full schedule.
Fees
Early: $1,895 (payment 4+ weeks ahead)
Standard: $2,095 (check/ACH) · $2,165 (card)
Group discount: $200 off per attendee for 3+ from the same organization.
Also Available
- Corporate on-site delivery at your facility
- Private cohort sessions
- Digital curriculum licensing
Seminar Overview
The vehicle is an electronic system wrapped in structure, and the engineers who design the structure increasingly must understand the electronics it carries. Built from MIT OpenCourseWare's electronics, digital-systems, and systems curriculum, this seminar teaches the electrical and embedded-engineering foundation: circuits and components, digital electronics, microcontrollers and embedded software, sensors and actuators, and the in-vehicle network (CAN, LIN, Ethernet/AUTOSAR integration). It is the practical complement to ETS's packaging and SDV courses — giving structural and materials engineers the electronics literacy their programs now require.
Ideal Learner
- Mechanical, structural, and packaging engineers integrating electronics
- Engineers coordinating cross-disciplinary (EE + ME) vehicle programs
- Program managers needing electronics-systems literacy
- Materials engineers designing housings for electronic content
- Engineers working with ECUs, sensors, and in-vehicle networks
Learning Objectives
- Read and reason about basic circuits and electronic components
- Explain digital logic, microcontrollers, and embedded software fundamentals
- Understand sensors and actuators and their interface requirements
- Navigate in-vehicle networks and electrical-distribution architecture
- Coordinate EE + ME integration with technical grounding
Consulting Sessions
Seminar attendees can sign up for individual consulting sessions with the instructor. Sessions are free for registered attendees, first-come first-served — sign up when registering by calling 248-539-0473 or during the seminar.
Seminar Outline
- Voltage, current, resistance, power, and passive components
- Semiconductors, transistors, and integrated circuits
- Reading schematics and datasheets
- Logic gates, digital signals, and state
- Microcontrollers, embedded processors, and memory
- From signal to decision to actuator
- Operating systems, real-time, and bare-metal
- C/embedded patterns engineers should recognize
- Debugging, validation, and safety software (ISO 26262)
- Sensing: temperature, pressure, position, acceleration
- Actuation: motors, solenoids, valves
- Interface: ADC, PWM, communication with ECUs
- CAN, LIN, FlexRay, Ethernet, and AUTOSAR roles
- Network architecture and zonal distribution
- Diagnostics (UDS/ODX) in the connected vehicle
- Thermal, EMC, and packaging interaction with electronics
- Power distribution and high-voltage (EV) electronics
- Integration risk across EE and structure
- Attendees map an electronics-bearing component end-to-end
- Identify integration risks and interfaces
- Present the coordinated engineering plan
More in Track H — Electrical & Electronic Engineering
- H-01 · Digital Signal Processing for Automotive Systems — 3-day · Advanced
- H-03 · Cryptography & Secure Communications — 2-day · Intermediate
- H-04 · Robotics & Autonomous Control — 3-day · Advanced
- H-05 · Connector & Terminal Engineering for Polymer Components — 2-day · Intermediate-Advanced